Method for repairing interconnect interruptions by bridging with

Details Method for repairing interconnect interruptions by bridging with Method for repairing interconnect interruptions by bridging with

1989-03-23

1990-03-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2940216, 174 685, 219 7801, 219 8621, 219 8624, 219119, 228103, 228119, 427140, H05K 300

Patent

active

049089382

ABSTRACT:
A method for repairing interconnect interruptions. Faults at the interconnects occurring in manufacturing processes of printed circuit boards were previously repaired with suitable methods. The fashioning of the interconnects in a meander form and their miniaturization requires a completely new procedure. The dimensions of current interconnects amount, for example, to: width.times.height=70 .mu.m.times.20 .mu.m. For repairing such interconnects that are usually arranged in extremely tight proximity on an interconnect carrier, it is necessary to position preforms utilized for repair absolutely congruently on the interconnect interruption and to hold them until the joining zones are completely formed between the preform and the interconnect. This is achieved by use of an insulating foil having work windows and by use of a preform panel that contains a plurality of preforms. The preform is joined to the interconnect by resistance heating with a first electrode system and is separated from the preform panel with a second electrode system.

REFERENCES:
patent: 3964666 (1976-06-01), Dinella et al.
patent: 4259367 (1981-03-01), Dougherty, Jr.
patent: 4403410 (1983-09-01), Robinson
IBM Tech. Discl. Bull., vol. 5, No. 9, Feb. 1963, pp. 16-17, by Hairabedian.
"Open Conductor Repair for Glass Metal Module", by F. M. Tappen, IBM Technical Disclosure Bulletin, vol. 14, No. 10, Mar. 1972, p. 2915.
"A High-Speed Soldering System", Design Engineering, vol. 51, No. 4, Oct. 1980, Waseca, Minn., p. 23.

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