Method for repairing defects in a conductive substrate using...

Electric heating – Metal heating – For bonding with pressure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S119000

Reexamination Certificate

active

07141754

ABSTRACT:
A method for repairing defects in a substrate including the steps of placing a consumable filler slug in contact with the substrate in the vicinity of the defect; placing at least one electrically conductive cover sheet in contact with a portion of the consumable filler slug; bringing a first electrode and a second electrode in contact with the at least one cover sheet and applying a force; and transmitting electrical current between the electrodes, thereby resistively heating the at least one cover sheet and conductively heating the consumable slug and a portion of the substrate resulting in coalescence in a substantially liquid pool that fills the defect. The pool is then cooled to solidification under pressure. Alternative embodiments eliminate the need for the conductive cover sheet(s) by utilizing electrodes having increased electrical and thermal resistance. The consumable slug may be formed as a single unit or multiple sections, and may incorporate sacrificial retainers.

REFERENCES:
patent: 1039673 (1912-09-01), Schatz
patent: 1154808 (1915-09-01), Rietzel
patent: 1278357 (1918-09-01), Lachman
patent: 1330241 (1920-02-01), Cutter
patent: 1367553 (1921-02-01), Kicklighter
patent: 1568080 (1926-01-01), Meadowcroft
patent: 1592605 (1926-07-01), Ledwinka
patent: 1939395 (1933-12-01), Hughes
patent: 2817981 (1957-12-01), Brownell
patent: 3081587 (1963-03-01), Heckethorn
patent: 3934107 (1976-01-01), Evertz
patent: 4096374 (1978-06-01), Gasparrini
patent: 4225772 (1980-09-01), Bacha
patent: 5075531 (1991-12-01), Sofue et al.
patent: 6107595 (2000-08-01), Peterson
patent: 6281467 (2001-08-01), Gould et al.
patent: 6460750 (2002-10-01), Coletta et al.
patent: 6545244 (2003-04-01), Gould et al.
patent: 2 000 710 (1979-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for repairing defects in a conductive substrate using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for repairing defects in a conductive substrate using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for repairing defects in a conductive substrate using... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3705892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.