Method for repair of opens in thin film lines on a substrate

Coating processes – Electrical product produced – Welding electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427140, 427142, 427148, 427264, B05D 312

Patent

active

047043040

ABSTRACT:
Disclosed is a method for repairing opens in thin film conductor lines on a substrate, preferably a multi-layered ceramic substrate. An unpatterned repair metal film is placed over a general area of open defects in conductive lines on a substrate. Preferably, this metal is placed over the conductive lines and opens therein by decal transfer. The assembly is then heated to cause diffusion bonding between the repair metal and conductive lines, but not between the repair metal and substrate. After diffusion bonding, the structure has metal bridges formed across any open defects covered by the repair film and also between adjacent conductive lines. The area of repair is then subjected to ultrasonic energy in a liquid ambient for a time at least long enough to remove metal bridges between adjacent conductive lines, but less than that required to remove repair metal bridges over the opens in the conductive lines. The resultant structure has metal bridges spanning opens in the conductive lines, and no metal bridges between adjacent conductive lines.

REFERENCES:
patent: 3614832 (1971-10-01), Chance et al.
patent: 4442137 (1984-04-01), Kumar
patent: 4493856 (1985-01-01), Kumar et al.
patent: 4501768 (1985-02-01), Kumar
patent: 4504322 (1985-03-01), Adwalpalker et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for repair of opens in thin film lines on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for repair of opens in thin film lines on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for repair of opens in thin film lines on a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1673811

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.