Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-06-17
1998-09-29
Stemmer, Daniel
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
2940201, 1563093, B29C 7304, B32B 3500
Patent
active
058141740
ABSTRACT:
A method of repairing an area of metallization that has lifted from a circuit board substrate uses a dry film epoxy placed between the lifted metallization and the substrate. Downward pressure and heat are simultaneously applied to the lifted area to rebond it to the substrate. Both metallization pads and traces may be repaired with the method, and the resulting bond may be stronger than that originally present. When heated, the dry film epoxy will melt and cure very quickly, requiring no further processing. The method is particularly useful when repairing circuit boards intended for microwave circuitry, in which conductive ribbons are gap welded to metallization pads. A metallization pad repair operation may be combined with a ribbon attachment operation, accomplishing both with one gap welding operation. The gap welder provides the downward force and heat necessary to bond the ribbon and repair the lifted pad.
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"Ablefilm.RTM. 501-Low Temperature Cure, Eletronics Grade Adhesive Film", Ablestik Laboratories, Rev. Aug. 1982.
Gudmestad Terje
Hughes Electronics Corporation
Leitereg Elizabeth E.
Sales Michael W.
Stemmer Daniel
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