Method for rendering non-platable surfaces platable

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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106 111, 427 98, 427304, 427437, 427438, C23C 302, B05D 310

Patent

active

041817605

ABSTRACT:
A process is described for the reception of electroless plating onto a non-catalytic metal or alloy substrate, non-catalytic to conventional electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition comprising ions selected from the group consisting of nickel, cobalt, iron and mixtures thereof; and a suitable reducing agent capable of chemically interacting with the non-catalytic metal or alloy and the metal ions in the promoter composition and further wherein the relative concentration of the reducing agent to metal ions is so adjusted as to yield first a reaction of the reducing agent with the non-catalytic metal or alloy and thereafter a heterogeneous reduction of the metal ions; and thereafter contacting the treated substrate with a conventional electroless plating bath, e.g, a nickel or cobalt-hypophosphite type bath or a copper-formaldehyde type bath for the metallic build-up.

REFERENCES:
patent: 3666529 (1972-05-01), Wright et al.
patent: 3772056 (1973-11-01), Polichette et al.
patent: 3853590 (1974-12-01), Kadison et al.
patent: 3870526 (1975-03-01), Pearlstein et al.
patent: 3958048 (1976-05-01), Donovan et al.
patent: 3962494 (1976-06-01), Nuzzi
patent: 3993801 (1976-11-01), Feldstein
patent: 4002778 (1977-01-01), Bellis et al.
Lowenheim, F.A.; Modern Electroplating, New York, John Wiley & Sons, Inc.; 1974, pp. 711, 727, 728.

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