Method for removing the strain of a substrate for an element of

Details Method for removing the strain of a substrate for an element of Method for removing the strain of a substrate for an element of

1976-06-21

1977-05-31

Steiner, Arthur J.

Metal working

Method of mechanical manufacture

Electrical device making

148 15, 148 129, C21D 104, H05K 1300

Patent

active

040260100

ABSTRACT:
A method for removing the strain of a substrate for an element of integrated circuit, which comprises mounting the substrate on a vibrating plate in such a manner as to be movably supported with the aid of rubber string, forcedly vibrating the vibrating plate, whereby the substrate undergoes sympathetic vibrations which cause the substrate to be stress relieved.

REFERENCES:
patent: 4001053 (1977-01-01), Igisu

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