Method for removing spin-on-glass at wafer edge

Details Method for removing spin-on-glass at wafer edge Method for removing spin-on-glass at wafer edge

1997-01-08

1999-06-22

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 26, 134 32, 134 33, 134 254, 134 38, 134 42, B08B 308

Patent

active

059139790

ABSTRACT:
The present invention provides a method for removing unwanted coating layer at wafer edge by first immersing the wafer edge in a cleaning solution and then immersing in a rinsing solution such as deionized water to remove the residual cleaning solution from the surface of the wafer. The wafer can be dried in a subsequent spin dry process.

REFERENCES:
patent: 5451291 (1995-09-01), Park et al.
patent: 5454970 (1995-10-01), Flaningam et al.
patent: 5643818 (1997-07-01), Sachdev et al.
patent: 5688411 (1997-11-01), Kutsuzawa et al.

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