Method for removing particles on semiconductor wafers

Details Method for removing particles on semiconductor wafers Method for removing particles on semiconductor wafers

2005-12-13

2005-12-13

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S002000, C134S003000, C134S026000, C134S028000, C134S034000, C438S906000

Reexamination Certificate

active

06973934

ABSTRACT:
The purpose of the present invention is to remove minute particles adhered to the surface of semiconductor wafers effectively in the cleaning process of semiconductor wafers. In the final rinsing step using ultra-pure water or hydrogen water and carried out after cleaning of semiconductor wafers with HF solution, ultrasonic waves are irradiated in the cleaning solution after a prescribed time delay (preferably 20-30 sec or more).

REFERENCES:
patent: 5733434 (1998-03-01), Harada et al.
patent: 6004399 (1999-12-01), Wong et al.
patent: 6158445 (2000-12-01), Olesen et al.
patent: 6378534 (2002-04-01), Olesen et al.
patent: 6444255 (2002-09-01), Nagahara et al.
patent: 6488037 (2002-12-01), Guldi

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