Method for removing microelectronic circuits from substrates and

Details Method for removing microelectronic circuits from substrates and Method for removing microelectronic circuits from substrates and

1998-03-27

1999-08-17

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156 94, 156584, 2940203, 29764, B32B 3500

Patent

active

059388820

ABSTRACT:
The method of removing an epoxy bonded microelectronic component from a substrate includes the steps of heating a removal tool comprising a blade portion. The heated blade portion engages against the cured epoxy positioned around the edge of the component, and the epoxy is removed. The blade portion is positioned between an edge of the component and an adjacent portion of the substrate to lift the component from the substrate. A screwdriver receiving tip can also be attached to the removal tool. The screwdriver receiving tip includes an orifice that receives a screwdriver shaft that is freely rotatable therein. The removal tool is heated, thereby heating the screwdriver receiving tip and screwdriver shaft so that any screw to be removed is heated and removed. A tool is also disclosed for removing the microelectronic component from a substrate. The tool includes a removal tool comprising a proximal body and a distal heating end. A screwdriver receiving tip is removably mounted on the distal heating end of the removal tool. The screwdriver receiving tip has an orifice for receiving a screwdriver shaft.

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Brochure; Pace Incorporated; Laurel, MD, USA; page 36, 1987.

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