Metal fusion bonding – Process of disassembling bonded surfaces – per se
Patent
1994-06-30
1995-10-17
Ramsey, Kenneth J.
Metal fusion bonding
Process of disassembling bonded surfaces, per se
B23K 1018
Patent
active
054582814
ABSTRACT:
The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.
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Downing Andrew J.
Foster Donald C.
Puttlitz Karl J.
Ahsan Aziz M.
International Business Machines - Corporation
Ramsey Kenneth J.
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