Method for removing meltable material from a substrate

Metal fusion bonding – Process of disassembling bonded surfaces – per se

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B23K 1018

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active

054582814

ABSTRACT:
The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

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