Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating
Patent
1980-12-01
1981-10-27
Weisstuch, Aaron
Chemistry: electrical and wave energy
Processes and products
Vacuum arc discharge coating
204298, C23C 1500
Patent
active
042971900
ABSTRACT:
A workpiece (16), for example a magnetic bubble memory wafer, is held in place, and heat is removed from it by an expandable heat pipe (22) during a process performed in a vacuum as, for example, a sputter etch process. The expandable heat pipe (22) includes two plates (24, 26) joined by a bellows (28) to form a sealed chamber containing a vaporizable liquid such as water. During loading of the wafers the heat pipe (22) is compressed by atmospheric pressure and thereby facilitates easy assembly of the wafer (16) and heat pipe (22) into a holding fixture (10) which in turn is bolted to a cooling plate (30) situated inside a vacuum chamber. When the chamber is evacuated, the heat pipe (22) expands to hold the wafer (16) in place and form a good thermal path from the wafer (16) to the cooling plate (30). In an alternate embodiment the heat pipe (22) does not completely fill the gap from the wafer (16) to the cooling plate (30) in a vacuum at room temperature, but rather expands to fill the gap when the heat pipe (22) is heated by the wafer (16). The expanding heat pipe (22) holds the wafer (16) at a constant, predetermined temperature above the temperature of the cold plate.
REFERENCES:
patent: 3399717 (1968-09-01), Cline
patent: 3463224 (1969-08-01), Myers
patent: 3529417 (1970-09-01), Knight
patent: 3957107 (1976-05-01), Altoz et al.
patent: 3977955 (1976-08-01), Nevis et al.
patent: 4000776 (1977-01-01), Kroebig et al.
patent: 4051890 (1977-10-01), Melchior
patent: 4060470 (1977-11-01), Clarke
patent: 4115184 (1978-09-01), Poulsen
patent: 4130762 (1978-12-01), Oppel
patent: 4139051 (1979-02-01), Jones et al.
Houseweart G. W.
Weisstuch Aaron
Western Electric Co. Inc.
LandOfFree
Method for removing heat from a workpiece during processing in a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for removing heat from a workpiece during processing in a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for removing heat from a workpiece during processing in a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-278314