Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Patent
1986-01-27
1988-09-06
Sneed, H. M. S.
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
134 254, 134 34, 134 35, 134 40, 15 21R, 15102, 228 19, 228 37, 228 40, 51320, B08B 700
Patent
active
047690836
ABSTRACT:
A method for removing excess solder from a printed circuit board is practiced by mixing a quantity of ceramic beads with an oil to form a fluidized bed mixture. The fluidized bed mixture is heated to a temperature above the melting point of a solder on the printed circuit board. A surface of the printed circuit board to be cleaned is placed in contact with the heated fluidized bed and agitated against the bed to remove excess solder.
REFERENCES:
patent: 2671264 (1954-03-01), Pessel
patent: 3266136 (1966-08-01), Gutbier
patent: 3482755 (1969-12-01), Raciti
patent: 3553824 (1971-01-01), Kozhicky
patent: 3583063 (1971-06-01), Growney
patent: 3604609 (1971-09-01), Walls
patent: 3604610 (1971-09-01), Fortune
patent: 3795358 (1974-03-01), Sarnacki et al.
patent: 4113165 (1978-09-01), Ott
patent: 4325780 (1982-04-01), Schultz, Sr.
patent: 4334646 (1982-06-01), Campbell
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4541358 (1985-09-01), Spigarelli et al.
patent: 4555302 (1985-11-01), Urbanik
patent: 4589926 (1986-05-01), Holmstrand
Cohen Sharon T.
Edgell G. Paul
Fox Robert J.
Gould Inc.
Sachs Edward E.
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