Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Treating polymer containing material or treating a solid...
Reexamination Certificate
2006-06-26
2008-12-09
Boykin, Terressa M (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Treating polymer containing material or treating a solid...
C422S131000
Reexamination Certificate
active
07462685
ABSTRACT:
A resin recycling method that produces essentially contaminant-free synthetic resin material in an environmentally safe and economical manner. The method includes receiving the resin in container form. The containers are then ground into resin particles. The particles are exposed to a solvent, the solvent contacting the resin particles and substantially removing contaminants on the resin particles. After separating the particles and the resin, a solvent removing agent is used to remove any residual solvent remaining on the resin particles after separation.
REFERENCES:
patent: 4379525 (1983-04-01), Nowicki et al.
patent: 4543364 (1985-09-01), Nankee et al.
patent: 4578184 (1986-03-01), Rasmussen
patent: 4680060 (1987-07-01), Gupta et al.
patent: 4714526 (1987-12-01), Pennisi et al.
patent: 4746422 (1988-05-01), Grimm
patent: 4918160 (1990-04-01), Kondoh et al.
patent: 4919816 (1990-04-01), Tsao
patent: 4959232 (1990-09-01), Underwood
patent: 5009746 (1991-04-01), Hossain et al.
patent: 5011087 (1991-04-01), Richardson et al.
patent: 5013366 (1991-05-01), Jackson et al.
patent: 5049647 (1991-09-01), Al-Ghatta
patent: 5073203 (1991-12-01), Al-Ghatta
patent: 5080845 (1992-01-01), Herrmann et al.
patent: 5110055 (1992-05-01), Teeny
patent: 5115987 (1992-05-01), Mithal
patent: 5126058 (1992-06-01), Beckman
patent: 5148993 (1992-09-01), Kashiwagi
patent: 5160441 (1992-11-01), Lundquist
patent: 5185041 (1993-02-01), Anderson et al.
patent: 5233021 (1993-08-01), Sikorski
patent: 5252614 (1993-10-01), Sisson
patent: 5258491 (1993-11-01), Agreda et al.
patent: 5270067 (1993-12-01), Underwood et al.
patent: 5271773 (1993-12-01), Hamilton et al.
patent: 5279615 (1994-01-01), Mitchell et al.
patent: 5290505 (1994-03-01), Huber et al.
patent: 5294263 (1994-03-01), Riso
patent: 5304253 (1994-04-01), Grant
patent: 5316591 (1994-05-01), Chao et al.
patent: 5330581 (1994-07-01), Syrinek
patent: 5339844 (1994-08-01), Stanford
patent: 5370742 (1994-12-01), Mitchell et al.
patent: 5401322 (1995-03-01), Marshall
patent: 5456759 (1995-10-01), Stanford, Jr.
patent: 5462973 (1995-10-01), Serad et al.
patent: 5467492 (1995-11-01), Chao
patent: 5533538 (1996-07-01), Marshall
patent: 5558913 (1996-09-01), Sasaki et al.
patent: 5651276 (1997-07-01), Purer
patent: 5669251 (1997-09-01), Townsend
patent: 5711820 (1998-01-01), Smith et al.
patent: 5739270 (1998-04-01), Farmer et al.
patent: 5756657 (1998-05-01), Sawan et al.
patent: 5780520 (1998-07-01), Reeves et al.
patent: 5784905 (1998-07-01), Townsend
patent: 5822818 (1998-10-01), Chao
patent: 5858022 (1999-01-01), Romack
patent: 5858107 (1999-01-01), Chao
patent: 5925192 (1999-07-01), Purer
patent: 6200352 (2001-03-01), Romack
patent: 6200943 (2001-03-01), Romack
patent: 6212916 (2001-04-01), Carr
patent: 6248136 (2001-06-01), McClain
patent: 6258766 (2001-07-01), Romack
patent: 6260390 (2001-07-01), Carr
patent: 6287640 (2001-09-01), McClain
patent: 6297206 (2001-10-01), Romack
patent: 6306222 (2001-10-01), Kim et al.
patent: 6312528 (2001-11-01), Summerfield et al.
patent: 6369192 (2002-04-01), Dufresne et al.
patent: 6402857 (2002-06-01), Clark et al.
patent: 6536059 (2003-03-01), McClain et al.
patent: 6554005 (2003-04-01), Cords et al.
patent: 6616770 (2003-09-01), Musha et al.
patent: 6755871 (2004-06-01), Damaso et al.
patent: 6770680 (2004-08-01), Klenk
patent: 6919383 (2005-07-01), Khan et al.
patent: 6938439 (2005-09-01), Wikstrom et al.
patent: 2001/0000001 (2001-03-01), Clark et al.
patent: 2002/0033550 (2002-03-01), Suehara
patent: 2002/0045730 (2002-04-01), Yanagida
patent: 2002/0048629 (2002-04-01), Romack et al.
patent: 2002/0189644 (2002-12-01), Wack
patent: 2003/0199596 (2003-10-01), Koike et al.
patent: 2003/0213747 (2003-11-01), Carbonell et al.
patent: 2003/0217764 (2003-11-01), Masuda et al.
patent: 2004/0079394 (2004-04-01), Thouvenot et al.
patent: 2006/0005572 (2006-01-01), Wikstrom et al.
patent: 4029720 (1990-04-01), None
patent: 359106 (1990-03-01), None
patent: 0492043 (1992-07-01), None
patent: 521418 (1993-01-01), None
patent: 538730 (1993-04-01), None
patent: 92-09413 (1992-06-01), None
Operation Enterprise, Plastic Recycling Company to Move into Riverbank Industrial Complex, pp. 1-4, Fall 2004, Independence, MO.
Food Production Daily, Amcor Invests Heavily to Expand PET Recycling Capabilities, pp. 1-3, Jan. 27, 2003, Europe.
“Design for Recycling Guidelines”, Association of Post-consumer Plastic Recyclers, Washington, DC, 2006.
“Plastic Recycling Process Improved”, NC State researchers Developing Unique Technology, http://www.engr.ncsu.edu
ews
ews—articles/roberts.html, Apr. 3, 2003.
U.S. Appl. No. 11/096,880, Bohnert, George W., et al, filed Apr. 1, 2005.
U.S. Appl. No. 11/277,587, Bohnert, George W. et al, filed Mar. 27, 2006.
U.S. Appl. No. 11/426,522, Bohnert, George W. et al, filed Jun. 26, 2006.
U.S. Appl. No. 11/421,271, Bohnert, George W. et al, filed May 31, 2006.
U.S. Appl. No. 11/734,615, Bohnert, George W. et al, filed Apr. 12, 2007.
U.S. Appl. No. 11/733,590, Bohnert, George W. et al, filed Apr. 10, 2007.
U.S. Appl. No. 11/426,530, Bohnert, George W. et al, filed Jun. 26, 2006.
Bohnert George W.
Delaurentiis Gary M.
Hand Thomas E.
Boykin Terressa M
Honeywell Federal Manufacturing & Technologies, LLC
Hovey & Williams, LLP
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