Method for removing color resist for exposure alignment

Details Method for removing color resist for exposure alignment Method for removing color resist for exposure alignment

2007-03-06

2007-03-06

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

C216S023000

Reexamination Certificate

active

10840707

ABSTRACT:
A method for removing color resist from an exposure alignment mark. In an embodiment, a color resist layer is formed over a color filter substrate with an alignment mark thereon. A concentric tube system is provided with an outer tube surrounding an inner tube. A solvent is injected via the inner tube to contact and dissolve the color resist directly overlying the alignment mark. The dissolved color resist is extracted by the outer tube of the concentric tube system to expose the alignment mark. By repeating the dissolving and extraction steps, all alignment marks on the color filter substrate are consequently uncovered for subsequent exposure alignment.

REFERENCES:
patent: 5731110 (1998-03-01), Hishiro et al.
patent: 04206626 (1992-07-01), None

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