Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-01-04
2011-01-04
Smith, Bradley K (Department: 2894)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S108000, C438S109000, C257SE21499
Reexamination Certificate
active
07863094
ABSTRACT:
In a method for removing bubbles from adhesive layer of semiconductor chip package, one or more semiconductor chips are attached to or stacked on a base plate using an adhesive material. The base plate is selected from a substrate, a lead frame, and other carrier for carrying the semiconductor chips thereon. Before the adhesive material starts curing or becomes fully cured, the base plate with the semiconductor chips is placed in a processing tank which is preset to heat at a predetermined heating rising rate to a predetermined temperature and to apply a predetermined pressure for a predetermined period of time, so that bubbles presented in the adhesive material, at an interface between the adhesive material and the base, and at an interface between the adhesive material and the semiconductor chip are expelled from the adhesive material under the temperature and pressure in the processing tank.
REFERENCES:
patent: 2009/0286355 (2009-11-01), Yeh
Chen Yu-Cheng
Hung Shu-Hui
Ableprint Technology Co., Ltd.
Payen Marvin
Rosenberg , Klein & Lee
Smith Bradley K
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