Method for removing accumulated solder from probe card probing f

Details Method for removing accumulated solder from probe card probing f Method for removing accumulated solder from probe card probing f

1998-01-02

2000-09-19

Picardat, Kevin M.

Semiconductor device manufacturing: process

Repair or restoration

438 14, 134 2, 134 3, 134 6, 134 41, H01L 2100

Patent

active

061210587

ABSTRACT:
A method for removing deposits from a probing feature of a probe card. The method includes the step of exposing the probing feature of a probe card to a composition that chemically reacts with the deposits on the probing feature to remove the deposits from the probing feature while not substantially effecting the material comprising the probing feature.

REFERENCES:
patent: 3615950 (1971-10-01), Lacal
patent: 4314855 (1982-02-01), Chang et al.
patent: 5288332 (1994-02-01), Pustilnik et al.
patent: 5521518 (1996-05-01), Higgins
patent: 5657394 (1997-08-01), Schwartz et al.
patent: 5778485 (1998-07-01), Sano et al.
patent: 5802714 (1998-09-01), Kobayashi et al.
patent: 5814158 (1998-09-01), Hollander et al.

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