Method for removing a passivation layer prior to depositing...

Details Method for removing a passivation layer prior to depositing... Method for removing a passivation layer prior to depositing...

2006-08-31

2010-10-26

Nguyen, Khiem D (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

C438S629000, C257SE21579, C257SE21585

Reexamination Certificate

active

07820536

ABSTRACT:
By forming a thin passivation layer after the formation of openings connecting to a highly reactive metal region, any queue time effects may be significantly reduced. Prior to the deposition of a barrier/adhesion layer, the passivation layer may be efficiently removed on the basis of a heat treatment so as to initiate material removal by evaporation.

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