Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2008-04-08
2008-04-08
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S706000, C438S710000, C134S001100, C134S001200
Reexamination Certificate
active
07354865
ABSTRACT:
A method of removing the pattern resist that remains on a microchip wafer after etching a patterned layer that is supported by a spacer layer. After the etch, the wafer is cleaned with a develop clean process that removes polymer residues from the pattern resist surface. Next is an ash to remove the hardened pattern resist surface, followed by removal of the pattern resist.
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DiCarlo Anthony
Wesneski Lisa A.
Brady III Wade James
Brill Charles A.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Vinh Lan
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