Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1976-09-27
1977-11-22
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29588, 156247, 156268, B29B 300
Patent
active
040594670
ABSTRACT:
A technique is disclosed for the mechanical removal of elastomeric encapsulants from integrated circuits. The encapsulant to be removed is outlined by cutting, and the outlined area is cooled sufficiently either during or subsequent to cutting such that the encapsulant may be removed by gripping one edge with tweezers and peeling from the circuit.
REFERENCES:
patent: 2469849 (1949-05-01), Silver
patent: 3690984 (1972-09-01), Wanesky
patent: 3773578 (1973-11-01), Glendinning et al.
patent: 3969813 (1976-07-01), Minetti et al.
Mancke Ralph Gustavus
Soos Nicholas Alec
Bell Telephone Laboratories Incorporated
Birnbaum Lester H.
Weston Caleb
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