Method for removal of elastomeric silicone coatings from integra

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

29588, 156247, 156268, B29B 300

Patent

active

040594670

ABSTRACT:
A technique is disclosed for the mechanical removal of elastomeric encapsulants from integrated circuits. The encapsulant to be removed is outlined by cutting, and the outlined area is cooled sufficiently either during or subsequent to cutting such that the encapsulant may be removed by gripping one edge with tweezers and peeling from the circuit.

REFERENCES:
patent: 2469849 (1949-05-01), Silver
patent: 3690984 (1972-09-01), Wanesky
patent: 3773578 (1973-11-01), Glendinning et al.
patent: 3969813 (1976-07-01), Minetti et al.

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