Method for releasably mounting a substrate on a base providing h

Details Method for releasably mounting a substrate on a base providing h Method for releasably mounting a substrate on a base providing h

1979-02-22

1980-12-02

Anderson, Philip

Plastic and nonmetallic article shaping or treating: processes

With printing or coating of workpiece

Anti-stick or adhesion preventing coating

174 16HS, 264272, 264338, 357 75, 357 81, B29H 2104

Patent

active

042370868

ABSTRACT:
The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed between the treated surfaces of the substrate and base. Pressure is applied to cause the layer of resin to conform to irregularities in the two surfaces. This forms a heat transfer path between the substrate and base. It is particularly effective for heat transfer in a vacuum. Pressure on the conforming resin is maintained by rigid, releasable mechanical fasteners which hold the substrate to the base. Where good electrical conduction between the substrate and base is required in addition to good heat transfer, the resin is one of the electrically conductive types such as those filled with a powdered metal. Nondestructive removal of the substrate is accomplished by releasing the mechanical fasteners.

REFERENCES:
patent: 3182115 (1965-05-01), Moran et al.
patent: 3391242 (1968-07-01), Sudges
patent: 3805123 (1974-04-01), Rieger
patent: 3955169 (1976-05-01), Kerfoot et al.
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 3996447 (1976-12-01), Bouffard et al.
patent: 4034469 (1977-07-01), Koopman et al.

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