Optical waveguides – With optical coupler – With alignment device
Reexamination Certificate
2002-06-28
2004-10-12
Le, Thien M. (Department: 2876)
Optical waveguides
With optical coupler
With alignment device
C385S114000, C385S088000
Reexamination Certificate
active
06804438
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to optical connectors and, more particularly, to reducing optical coupling errors introduced by lack of precision in the connector parts used.
BACKGROUND
Typically, connectors used in fiber optics are keyed and formed to snap together in a very precise way to ensure that light is properly coupled between the two sides of the connectors and to minimize losses. As a result, the tolerances of the individual components before, and after, assembly is very important.
In the case of connectors, the connectors typically mounts onto a mating part that, for example, is mounted on a module in a precise way and the connector either ‘snaps’ onto the mating part to self lock (and may be easily removable) or it is crimped onto the mating part. Often, the mating part is manufactured to a particular specification so that connectors of a particular type, typically from other manufacturers, can connect to it.
The snapping type mating part typically requires high precision in its design, placement and attachment, as well as most, if not all, other critical components on the mating side. If the mating part lacks the requisite precision in either its manufacture or placement, it can cause a misalignment which, in the particular case, may still be acceptable, may be wholly unacceptable, or may be somewhere in between, depending upon the particular application in which it is being used.
The crimping type mating part has the same problems and further, is subject to the introduction of errors in alignment during crimping.
Moreover connectors are typically crimped or epoxied in a manner which may allow for adjustment in the X or Y planes, but provides little or no flexibility in adjusting for imprecision in the Z direction (i.e. the distance along the direction the connector is typically inserted) or for inaccuracies in “roll”, “pitch” or “yaw”.
In either case, this variability leads to increased cost, both in labor and materials, because the tolerance error in any two given pieces may be within their respective specifications but their combined errors are sufficiently great so as to cause problems in mating or with the efficiency of the coupling of light. Thus, even if such problems are not fatal to use of the components, they may nevertheless adversely affect performance and/or reliability.
SUMMARY OF THE INVENTION
We have recognized the above problems and created a way to:
1) ensure that the mating part to which connectors are attached are put on with high alignment precision,
2) ensure mating parts are secured permanently (absent unusual circumstances) on a module, and
3) allows flexibility in at least the three dimensions so as to reduce the precision required on pieces inside the connector and/or the mating part.
In general, the invention relates to the integration of connectors. More particularly, we have devised an optical connector mating unit, that can be mounted on another component, for example, an opto-electronic module, in a way that provides for high alignment accuracy between the two while reducing the accuracy requirements needed for those parts while ensuring that a good connection between an optical connector and the other component will be created.
Depending upon the particular implementation, our approach may have one or more of a number of advantages, including simplicity of manufacture, significantly lower tolerance on parts for connection, real-time flexibility on distance in the ‘Z’ dimension, flexibility in roll, pitch or yaw positioning, and an ability to compensate for slight variations in individual components on which the mating portion is mounted or to which the mating portion connects.
The advantages and features described herein are a few of the many advantages and features available from representative embodiments and are presented only to assist in understanding the invention. It should be understood that they are not to be considered limitations on the invention as defined by the claims, or limitations on equivalents to the claims. For instance, some of these advantages are mutually contradictory, in that they cannot be simultaneously present in a single embodiment. Similarly, some advantages are applicable to one aspect of the invention, and inapplicable to others. Thus, this summary of features and advantages should not be considered dispositive in determining equivalence. Additional features and advantages of the invention will become apparent in the following description, from the drawings, and from the claims.
REFERENCES:
patent: 5422970 (1995-06-01), Miller et al.
patent: 5433911 (1995-07-01), Ozimek et al.
patent: 6375365 (2002-04-01), Chau
patent: 6379984 (2002-04-01), Sandberg et al.
patent: 6406195 (2002-06-01), Hammond et al.
patent: 6419405 (2002-07-01), Boscha
patent: 6442318 (2002-08-01), Goldman
patent: 2002/0085816 (2002-07-01), Nishimura
patent: 2002/0159707 (2002-10-01), Mortzheim et al.
Aoki, Y., “Parallel and Bi-Directional Optical Interconnect Module Using Vertical Cavity Surface Emitting Lasers (VCSELs) and 3-D Micro Optical Bench (MOB)”,IEEE, pp. 9 and 10, 1999.
Chou, B. et al., “Multilayer High Density Flex Technology”,IEEE, pp. 1181-1189, 1999.
Datta, M. et al., A low-cost electroless plating method for producing flip-chip bondable and wire-bondable circuit pads for smart pixel application,IEEE, pp. 99-100, 1998.
Giboney, K.S., “Parallel-Optical Interconnect Development at HP Laboratories”,SPIE, vol. 3005, pp. 193-201, Feb. 1997.
Goldstein, J. et al., “Fluxless Flip-Chip For Multichip Modules”,IEEE, pp. 39-43, 1996.
Imler, B. et al., “Precision Flip-Chip Solder Bump Interconnects for Optical Packaging”, IEEE Electronic Components and Technology Conference, pp. 508-512, 1992.
Maj, T. et al., “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide”,Applied Optics, vol. 39, No. 5, pp. 683-689, Feb. 10, 2000.
McLaren T. et al., “Assembly of VCSEL Based Smart Pixel Arrays”, IEEE/LEOS Summer Topical Meeting: Smart Pixels, pp. 49 and 50, Aug. 1996.
Ohki, A. et al., “Multi-channel optical coupling between VCSEL arrays and multimode opticle fibers for a 40-channel parallel optical interconnection module”,IEEE, pp. 47 and 48, 1998.
Ohsaki, T., “ELectronic Packaging in the 1990's -A Perspective From Asia”,IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 14, No. 2, pp. 254-261, Jun. 1991.
International Search Report dated Oct. 28, 2002.
Dugas Roger
Stack Richard
Le Thien M.
Morgan & Finnegan , LLP
Xanoptix Inc.
LandOfFree
Method for relaxing mechanical tolerance in an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for relaxing mechanical tolerance in an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for relaxing mechanical tolerance in an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3274685