Method for reduction of defects in wet processed layers

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S060000, C205S099000

Reexamination Certificate

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10425782

ABSTRACT:
The present invention provides a method and apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed electroless deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed process solution to a processing unit or degassing the process solution in-situ, within the processing unit.

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Victoria Shannon et al., “Copper Interconnects for High-Volume Manufacturing”, Semiconductor International, May 2001.

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