Method for reducing thermal stress in an encapsulated integrated

Details Method for reducing thermal stress in an encapsulated integrated Method for reducing thermal stress in an encapsulated integrated

1992-11-04

1994-04-05

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, H01L 2156, H01L 2158, H01L 2160

Patent

active

053004590

ABSTRACT:
A method wherein a circuit substrate device is provided having a semiconductor element and a circuit substrate between which a protective resin is placed.
The protective resin has a smaller coefficient of linear expansion than that of the circuit substrate and a greater coefficient of linear expansion than that of the semiconductor element. Therefore, the protective resin may mitigate the influences of thermal stress due to differential in the thermal coefficients of expansion between the semiconductor element and circuit substrate to prevent warpage of the circuit substrate.

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