Method for reducing the frequency-temperature shift of piezoelec

Details Method for reducing the frequency-temperature shift of piezoelec Method for reducing the frequency-temperature shift of piezoelec

1995-08-15

1996-11-05

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29 2535, 156330, 310346, 427100, 427265, H01L 4122

Patent

active

055713637

ABSTRACT:
A method and device for selectively reducing the frequency-temperature shift of piezoelectric crystals. The piezoelectric device (100) includes a substrate (102), a piezoelectric element (106) and a temperature dependent interface structure (120) for beneficially stressing the piezoelectric element at a predetermined temperature range. The substrate (102), piezoelectric element (106) and temperature-dependent interface structure (120) define a piezoelectric package having a predetermined non-compensated third order Bechmann curve having a low temperature end and a high temperature end, with an inflection point therebetween, whereby the frequency-temperature shift is reducable on the third order Bechmann curve.

REFERENCES:
patent: 2106143 (1938-01-01), Williams
patent: 4661192 (1987-04-01), McShane
patent: 5405476 (1995-04-01), Knecht

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