Method for reducing the amount of particles which become airborn

Details Method for reducing the amount of particles which become airborn Method for reducing the amount of particles which become airborn

1982-07-30

1985-07-16

Bashore, S. Leon

Cleaning and liquid contact with solids

Processes

Including forming a solidified or hardened coating for cleaning

252626, B08B 700

Patent

active

045294496

ABSTRACT:
A method for reducing the amount of particles which become airborne during either or both the dismantling and moving of structures wherein a foam is sprayed on the structures prior to either or both the dismantling and moving of such structures.

REFERENCES:
patent: 3488219 (1970-01-01), Moroni
patent: 3757491 (1973-09-01), Gourdine
patent: 4000992 (1977-01-01), Cole, Jr.
patent: 4400220 (1983-08-01), Cole, Jr.
"Decommissioning of Nuclear Facilities: A Review of Status", Published: United Kingdom Atomic Energy Authority; Article from Atomic Energy Review, vol. 12, No. 1, 1974 by Bainbridge et al.
"The Use of Urethane Foam in the Decontamination and Decommissioning of Nuclear Facilities" by R. E. Hermetz, MLM-2853, DOE Inter. Decommissioning Symposium, Seattle, Wash., U.S.A., Oct. 10, 1982.
"The Use of Urethane Foam in Preparing for Decontamination and Decom. of Radioactive Facilities" by R. E. Hermitz, MLM-2797, Urethane Foam Expo-6, Orlando, Fla., U.S.A., Mar. 16, 1981.
Decontamination and Decommissioning of Nuclear Facilities, by T. S. LaGuardia, edited by Marilyn M. Osterhout, 1980 Plenum Press, New York, p. 438.

Affiliated with

Also associated with

Rating

Method for reducing the amount of particles which become airborn does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for reducing the amount of particles which become airborn, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for reducing the amount of particles which become airborn will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1734166