Metal treatment – Compositions – Heat treating
Patent
1984-06-13
1985-12-24
Roy, Upendra
Metal treatment
Compositions
Heat treating
29576T, 29576B, 148187, H01L 21265
Patent
active
045604207
ABSTRACT:
Temperature variations across the surface of a semiconductor wafer (12), having at least one major surface thereof exposed to a source of radiant heat energy (18), are reduced by positioning a reflective ring (30, 30', 30" or 30'") proximate the wafer edge (28). The reflective ring (30, 30', 30" or 30'") reflects the heat energy towards the wafer periphery (27) to provide substantially uniform heat across the wafer.
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AT&T - Technologies, Inc.
Levy R. B.
Roy Upendra
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