Method for reducing stress between substrates of differing...

Details Method for reducing stress between substrates of differing... Method for reducing stress between substrates of differing...

2005-02-16

2008-08-19

Kerns, Kevin P (Department: 1793)

Metal fusion bonding

Process

Plural filler applying

C228S229000

Reexamination Certificate

active

07413110

ABSTRACT:
A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

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