Method for reducing solder sticking on a printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

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Details

427 541, 427 96, 427316, 228203, H05K 334

Patent

active

043609686

ABSTRACT:
A method of inhibiting solder sticking between circuit elements of a partially uncured rubber-modified epoxy printed circuit board comprises exposing the board containing the circuit pattern thereon to UV radiation prior to the application of solder thereto.

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