Method for reducing removal forces for CMP pads

Details Method for reducing removal forces for CMP pads Method for reducing removal forces for CMP pads

2006-01-31

2006-01-31

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C438S692000

Reexamination Certificate

active

06991740

ABSTRACT:
An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.

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