Method for reducing pole height loss in the formation of a...

Details Method for reducing pole height loss in the formation of a... Method for reducing pole height loss in the formation of a...

2007-09-04

2007-09-04

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S603120, C029S603130, C029S603140, C029S603150, C029S603160, C029S603180, C360S122000

Reexamination Certificate

active

10957038

ABSTRACT:
A method for reducing plated pole height loss in the formation of a write pole for a magnetic write head is disclosed. The method includes forming a conductive layer on a thin film substrate, forming a photoresist layer on the conductive layer and forming a trench in the photoresist layer. A thick seed layer is then placed on the trench and on the photoresist layer surface using a collimator. Moreover, the process includes plating while applying a voltage to the thin film substrate where the electrically isolated seed layer is removed and the trench is filled with plating material, removing the photoresist layer, and removing the exposed portions of the conductive layer on the thin film substrate.

REFERENCES:
patent: 4402801 (1983-09-01), Omata et al.
patent: 5314596 (1994-05-01), Shukovsky et al.
patent: 5802700 (1998-09-01), Chen et al.
patent: 5804085 (1998-09-01), Wu et al.
patent: 5875542 (1999-03-01), Tran et al.
patent: 5901432 (1999-05-01), Armstrong et al.
patent: 6218283 (2001-04-01), Park et al.
patent: 6385008 (2002-05-01), Santini et al.
patent: 6451514 (2002-09-01), Iitsuka
patent: 6558516 (2003-05-01), Kamijima
patent: 2001/0022704 (2001-09-01), Hong
patent: 63094423 (1988-04-01), None
patent: 1176089 (1989-07-01), None
patent: 3108111 (1991-05-01), None
patent: 11025422 (1999-01-01), None
“Laminated Seed Layers for Plated Thin Film Heads and Structures”; IBM Technical Disclosure Bulletin; Jun. 1992; pp. 457-459.

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