Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2007-02-20
2007-02-20
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21502
Reexamination Certificate
active
11004750
ABSTRACT:
A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.
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Geyer Scott B.
Kulicke and Soffa Industries Inc.
Spletzer, Sr. Christopher M.
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