Method for reducing multiline effects on a printed circuit...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Reexamination Certificate

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06898844

ABSTRACT:
A method is provided for designing a printed circuit board. This may include analyzing at least one characteristic of a first plurality of relatively parallel conductive paths on the printed circuit board. The first plurality of relatively parallel conductive paths may be arranged in a pattern in a first area of the printed circuit board. The method may also include rearranging the pattern of conductive paths such that a second plurality of relatively parallel conductive paths in a second area of the printed circuit board have a different geometry or arrangement with respect to one another as compared to a geometry or arrangement of the first plurality of relatively parallel conductive paths in the first area.

REFERENCES:
patent: 04-079354 (1992-03-01), None
patent: 04-290297 (1992-10-01), None
patent: 04-313300 (1992-11-01), None
patent: 07-245575 (1995-09-01), None
patent: 2000-244133 (2000-09-01), None
The Development of a SPICE Model to Predict the Crosstalk Reduction of Coupled Lines, by D.N. Ladd et al Symposium on Antenna Technology and Applied Electromahnetics 1990 Conference Proc. First Ed. p. 761-5 1990.

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