Method for reducing gaseous species of contamination in wet proc

Details Method for reducing gaseous species of contamination in wet proc Method for reducing gaseous species of contamination in wet proc

1996-09-30

1999-12-14

McCamish, Marion E.

Cleaning and liquid contact with solids

Processes

Including regeneration, purification, recovery or separation...

134 42, 134 251, 134902, 134 254, 438800, 438906, 210600, 210194, C02F 120

Patent

active

060011890

ABSTRACT:
A method for wet processing of a semiconductor-containing substrate that reduces contamination in the wet process by removing undesired sources of gas contamination, the method comprising: pumping a processing liquid through a degasifier, exposing the semiconductor wafer, in a vessel, to the degasified processing liquid; and optionally recirculating the processing liquid through the degasifier and back into the vessel.

REFERENCES:
patent: 3964957 (1976-06-01), Walsh
patent: 5645727 (1997-07-01), Bhave et al.
Yasuyuki Yagi, et al., Advanced Ultrapure Water Systems with Low Dissolved Oxygen for Native Oxide Free Wafer Processing IEEE Transactions on Semiconductor Mfg., May 1992, vol. 5, No. 2 at 121-127.
CFM Technologies, printout of internet web site (http://www.cfmtech.com/tech.html) (Nov. 20, 1998).

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