Stone working – Work supports
Patent
1999-05-21
2000-09-05
Banks, Derris H.
Stone working
Work supports
451 41, 451388, B28D 704
Patent
active
06112740&
ABSTRACT:
A method of dicing a semiconductor wafer having a bottom side and a circuit side along a plurality of street indices. The method includes applying an adhesive to the bottom side of the wafer, placing the bottom side of the wafer on a chuck or a spacer having a plurality of recesses therein, aligning the street indices on the wafer with recesses in the chuck or spacer, and dicing the wafer along the street indices.
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Akram Salman
Wark James M.
Banks Derris H.
Micro)n Technology, Inc.
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