Method for reducing cu surface defects following cu ECP

Details Method for reducing cu surface defects following cu ECP Method for reducing cu surface defects following cu ECP

2005-03-08

2005-03-08

Koehler, Robert R. (Department: 1775)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating electrolytic or nonelectrolytic coating after it is...

C134S021000, C134S034000, C134S041000, C134S902000, C438S745000, C438S747000

Reexamination Certificate

active

06863796

ABSTRACT:
A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.

REFERENCES:
patent: 20010014410 (2001-08-01), Mitsuhashi et al.

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