Method for reducing an unevenness of a surface and method...

Details Method for reducing an unevenness of a surface and method... Method for reducing an unevenness of a surface and method...

2008-02-11

2010-12-14

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S689000, C438S443000, C257SE21230, C257SE21304

Reexamination Certificate

active

07851362

ABSTRACT:
In order to reduce an unevenness of a surface of a body, a sacrificial layer is applied to the surface, a chemical-mechanical polishing of the sacrificial layer and material of said body is performed to reduce the unevenness of the surface, and a remainder of the sacrificial layer, if any, may be removed.

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