Semiconductor device manufacturing: process – Gettering of substrate
Reexamination Certificate
2011-06-07
2011-06-07
Luu, Chuong A. (Department: 2892)
Semiconductor device manufacturing: process
Gettering of substrate
C438S014000, C438S022000, C438S004000
Reexamination Certificate
active
07955956
ABSTRACT:
The invention provides a method for recycling/reclaiming a monitor or test wafer and a method for testing an integrated circuit manufacturing process. After a monitor wafer has been used for testing one or more semiconductor wafer processing steps to determine adequacy for use with production wafers, deposited materials and other residues from the tested processing steps are removed, and the stripped wafer is subjected to a thermal anneal to repair defects in its surface and return it to a reusable condition.
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Barrett Gary C.
Bucher Bradley D.
Carr Colin L.
Brady III Wade J.
Franz Warren L.
Luu Chuong A.
Telecky Jr Frederick J.
Texas Instruments Incorporated
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