Method for recycling monitoring control wafers

Details Method for recycling monitoring control wafers Method for recycling monitoring control wafers

1998-05-21

2000-10-24

Wilczewski, Mary

Semiconductor device manufacturing: process

Repair or restoration

438 5, 438 10, 438 14, 438 17, 134 13, 134902, H01J 37317

Patent

active

061366137

ABSTRACT:
A method for recycling monitoring control wafers includes cleaning the wafers after performing a sheet resistance (Rs) measurement on a bare silicon monitoring control wafer of an ion implanter, and then converting the wafer into a recyclable control wafer. A recyclable control wafer for a thermal wave (TW) measurement of destruction can be obtained by forming a screen layer on the wafer, performing a TW measurement, performing ion implantation by the monitoring recipe, performing TW measurement again, performing ion drive-in to drive implanted ions into the deeper areas of the substrate, removing the screen layer, and then forming another screen layer on the wafer to put the wafer into the recycling process of a TW measurement.

REFERENCES:
patent: 4755049 (1988-07-01), Bomback et al.
patent: 4799392 (1989-01-01), Wilson et al.
patent: 5451529 (1995-09-01), Hsu et al.
patent: 5711848 (1998-01-01), Iturralde
patent: 5861632 (1999-01-01), Rohner
patent: 5908509 (1999-06-01), Olesen et al.
patent: 5950645 (1999-09-01), Olesen et al.

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