Method for recycling a substrate

Details Method for recycling a substrate Method for recycling a substrate

2006-04-04

2006-04-04

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

Reexamination Certificate

active

07022586

ABSTRACT:
The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing the residue from the substrate to a level substantially equivalent to that of the detachment profile, thus obtaining a substantially uniform planar surface on the substrate, and then polishing the entire surface of the substrate to eliminate defects.

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