Method for recovering scraps of multi-layer plastic sheet or fil

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156344, 209 11, 264 37, B32B 3500, B29B 1700

Patent

active

051941090

ABSTRACT:
A method for recovering and reusing a scrap multilayer plastic sheet or film comprising at least a base material layer and laminated with an adhesive resin comprising at least one of an ethylene-vinyl acetate copolymer, a styrene-isoprene copolymer, a styrene-butadiene copolymer, a styrene-methyl methacrylate copolymer and an ethylene-acrylic acid ester-maleic anhydride copolymer. The method comprises heating the scrap multilayer sheet or film to a temperature lower than the softening point of the base material layer to make the interlaminar peeling strength of the adhesive resin lower than the strength at break of a layer having the lowest strength at break, except for the adhesive layer, and separating the multilayer scrap into at least two scrap layers and recovering at least one scrap layer in sheet or film form. The present invention provides effective reuse of scrap with almost no reduction in physical properties. Furthermore the cost of the production or molding of the sheet can be reduced. Still further, it is not necessary to add an additive, a white pigment and the like for preventing thermal deterioration. When polypropylene is used as a base material in the present method, it is not necessary to use low viscosity polypropylene as is conventionally required. That is, since high viscosity polypropylene can be used, vacuum molding becomes easy and furthermore a multilayer sheet or film having desirable physical properties can be produced very economically.

REFERENCES:
patent: 3620860 (1971-11-01), Eckardt
patent: 4199109 (1980-04-01), Watanabe
patent: 4319938 (1982-03-01), Vires
patent: 4599131 (1986-07-01), Matuszak
patent: 4715920 (1987-12-01), Ruppman et al.
patent: 4808482 (1989-02-01), Benge et al.
patent: 4956033 (1990-09-01), Martin et al.

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