Method for recovering object to be treated after interruption

Details Method for recovering object to be treated after interruption Method for recovering object to be treated after interruption

1998-06-19

2000-12-19

Bratlie, Steven A.

Material or article handling

Process

Of moving material between zones having different pressures...

414217, 414937, 414939, H01L 2102, B65G 4907

Patent

active

061620106

ABSTRACT:
To a common transfer chamber 102 of a treatment system 100, a treatment chamber 104a of an etching system 104, treatment chambers 106a and 108a of first and second CVD systems 106 and 108, a cooling chamber (a post-treatment chamber) 110a of a cooling system 110, and first and second cassette chambers 112 and 114 are connected. In the common transfer chamber 102, a transport arm 118 and a positioning system 120 are arranged. When the treatment system 100 is restarted after being stopped during a treatment, wafers W are sequentially recovered into a cassette 116 on the basis of the control of an operation storage device, which stores therein the origin data and destination data of the wafers W. At this time, the wafers W heated to a very high temperature by a thin film deposition treatment are sequentially recovered into a cassette 116 after being cooled (post-treated), and other wafers W are sequentially recovered directly into the cassette 116. Thus, there is provided a method for recovering an object to be treated, into a cassette in a desired state when a treatment system is restarted after being stopped during a treatment.

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patent: 5740034 (1998-04-01), Saeki
patent: 5766360 (1998-06-01), Sato et al.
patent: 5820692 (1998-10-01), Baecker et al.
patent: 5900105 (1999-05-01), Toshima

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