Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2005-04-26
2005-04-26
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S127000
Reexamination Certificate
active
06884663
ABSTRACT:
A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.
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Dlugokecki Joseph J.
Nazareno Gerardo Bagalawig
Robbins Carmencita I.
Swendrowski Steven David
Brunson M.
Chambliss Alonzo
Delphon Industries, LLC
DLA Piper Rudnick
Gray Cary US LLP
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