Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1994-08-17
1997-04-22
Breneman, R. Bruce
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
451 41, 438692, 438977, 438471, H01L 21304
Patent
active
056228759
ABSTRACT:
A method of reclaiming a substrate wafer and a reclaimed substrate wafer. A semiconductor wafer having external layers from previous processing is reclaimed by etching the external layers and cup-wheel grinding an active surface of the wafer to remove semiconductor components such as diffused regions. Either the active surface or the backside of the wafer is then polished to a mirror finish to provide a highly crystalline surface. The cup-wheel grinding produces a pinwheel surface roughness pattern and is accomplished by grinding the wafer with a cup-shaped grinding wheel having an axis of rotation parallel to but offset from an axis of rotation of the wafer. Preferably, the rim of the cup-shaped grinding wheel always passes over the axis of rotation of the wafer.
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Exsil Company Brochure.
Breneman R. Bruce
Kobe Precision Inc.
Whipple Mathew
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