Method for re-attachment of a SMT component using a heated air j

Details Method for re-attachment of a SMT component using a heated air j Method for re-attachment of a SMT component using a heated air j

1998-09-01

2000-09-12

Ryan, Patrick

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

22818022, B23K 3100, B23K 3102

Patent

active

061164941

ABSTRACT:
The present invention provides an efficient method for attaching computer system components which greatly reduces or eliminates damage to the PC board or components. The method for attaching the computer component includes the steps of: positioning the component on the PC board so that the component leads are aligned with the corresponding pads on the PC board; attaching the anchoring leads to its corresponding pads on the PC board; and heating the attachment media with a heated air jet so that the heated air jet heats the attachment media to a temperature between the melting point of the attachment media and the vaporization point of the attachment media, wherein the heated air jet is moved back and forth along the edge of the component being attached.

REFERENCES:
patent: 4696096 (1987-09-01), Green et al.
patent: 4752025 (1988-06-01), Stach et al.
patent: 5376403 (1994-12-01), Capote et al.
patent: 5511306 (1996-04-01), Denton et al.
Dyamant Industrie--Laser Serie 100 Support Materials Organization Owner's Manual--Manufacture's version, Jun. 1993, 13 unnumbered pages.
Eric Mouton, Laser!! For Repair, Oct. 1991, 8 unnumbered pages.
COM-KYL Inc. Product Catalog, 5 unnumbered pages.

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