Method for quartz bump defect repair with less substrate damage

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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C204S298360

Reexamination Certificate

active

10834895

ABSTRACT:
A method for minimizing damage to a substrate while repairing a defect in a phase shifting mask for an integrated circuit comprising locating a bump defect in a phase shifting mask, depositing a first layer of protective coating to an upper surface of the bump defect, depositing a second layer of protective coating to areas of the phase shifting mask adjacent the bump defect, etching the first layer of protective coating and removing the bump defect.

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patent: 6322935 (2001-11-01), Smith
patent: 2001/0027917 (2001-10-01), Ferranti et al.

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