Method for providing nano-structures of uniform length

Semiconductor device manufacturing: process – Miscellaneous

Reexamination Certificate

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C977S726000, C430S644000, C156S598000

Reexamination Certificate

active

06998358

ABSTRACT:
This invention relates to the field of nanotechnology. Specifically the invention describes a method for cutting a multiplicity of nano-structures to uniform dimensions of length, length and width, or area, or to a specific distribution of lengths or area using various cutting techniques.

REFERENCES:
patent: 2003/0039816 (2003-02-01), Wang et al.
patent: 07172807 (1995-07-01), None
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