Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Patent
1985-07-05
1986-02-18
Anderson, Philip
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
264267, 264273, B29C 3912
Patent
active
045713227
ABSTRACT:
A method for providing insulated holes in a conductive substrate by first punching oversized holes in the substrate, then filling the holes with an insulator and then forming an aperture of a desired diameter, less than the diameter of the hole originally punched in the substrate, through the insulator to leave an annular sleeve of insulative material within each hole.
REFERENCES:
patent: 3893233 (1975-07-01), Glover
patent: 3972974 (1976-08-01), Pico
patent: 4202091 (1980-05-01), Ohnishi
Auerbach Abraham
Eichelberger Charles W.
Wojnarowski Robert J.
Anderson Philip
Davis Jr. James C.
General Electric Company
Krauss Geoffrey H.
Snyder Marvin
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