Method for providing improved insulation in VLSI and ULSI circui

Details Method for providing improved insulation in VLSI and ULSI circui Method for providing improved insulation in VLSI and ULSI circui

1988-12-16

1991-01-22

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437195, 437235, 437927, H01L 21288

Patent

active

049871013

ABSTRACT:
An improved VLSI and ULSI structure and a method of forming the same are provided. The structure starts with a base member having a plurality of supports formed thereon and extending upwardly therefrom. A selectively removable material is deposited on the base member and around the supports. An insulating cap is formed over the supports and the removable material. Access openings are provided through the cover (or base) and the removable material is removed through the access openings. Thereafter a partial vacuum is formed in the space evacuated by the removable material, and the access openings sealed to provide a dielectric medium around the supports and between the base and cap member having a dielectric constant of less than 2.0.

REFERENCES:
patent: 3689992 (1972-09-01), Schutz et al.
patent: 3890636 (1975-06-01), Harada et al.
patent: 3925880 (1975-12-01), Rosvold
patent: 3932226 (1976-01-01), Klatskin et al.
patent: 4289846 (1891-09-01), Parks et al.
patent: 4849071 (1989-07-01), Evans et al.

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