Method for providing an inlay on a substrate

Details Method for providing an inlay on a substrate Method for providing an inlay on a substrate

1992-01-13

1993-03-30

Woo, Jay H.

Plastic and nonmetallic article shaping or treating: processes

With printing or coating of workpiece

Applying indicia or design

264129, 264162, 264345, 264347, 264DIG65, C04B 4100

Patent

active

051981688

ABSTRACT:
A method for providing an inlay on a substrate includes providing a recess in the substrate, preheating the substrate to a temperature of approximately 150.degree. F., mixing an epoxy resin with an epoxy hardener, and placing the mixture into the recess so that the mixture hardens in the recess and the heat stored in the substrate reduces the viscosity of the mixture, to aid in the removal of bubbles.

REFERENCES:
patent: 3420925 (1969-01-01), Sharif
patent: 3463653 (1969-08-01), Lether
patent: 3852145 (1974-12-01), Kloweit
patent: 4036929 (1977-07-01), Gould
patent: 4355808 (1982-10-01), Jarnigan et al.
patent: 4737403 (1988-04-01), Simpson et al.
patent: 4844850 (1989-07-01), Harder

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