Method for providing an electroless copper plating bath in the t

Details Method for providing an electroless copper plating bath in the t Method for providing an electroless copper plating bath in the t

1984-01-03

1985-08-13

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 302

Patent

active

045347972

ABSTRACT:
An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 2996408 (1961-08-01), Lukes
patent: 3075855 (1963-01-01), Agens
patent: 3075856 (1963-01-01), Lukes
patent: 3844799 (1974-10-01), Underkofler et al.
patent: 4096301 (1978-06-01), Slominski et al.
patent: 4152467 (1979-05-01), Alpaugh et al.
patent: 4276323 (1981-06-01), Oka et al.
patent: 4286965 (1981-09-01), Vanhumbeeck et al.
patent: 4324589 (1982-04-01), Gulla et al.

Affiliated with

Also associated with

Rating

Method for providing an electroless copper plating bath in the t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for providing an electroless copper plating bath in the t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for providing an electroless copper plating bath in the t will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2316573